| Preparation of Mold Cleaning Rubber for Epoxy Packaging Mold and Evaluation of Its Cleaning Effect |
| Received:May 13, 2019 Revised:May 14, 2019 |
| DOI：10.12136/j.issn.1000-890X.2019.11.0848 |
| Key Words: packaging mold；epoxy resin；mold cleaning rubber；cleaning agent；bonding strength； swelling property；evaluation method |
| Author Name | Affiliation | E-mail | | HAUGN Jian | Beijing Institute of Petroleum and Chemical Industry | saber0624@163.com | | CAO Xiwei | Beijing Institute of Petroleum and Chemical Industry | | | JI Changqing | Beijing Institute of Petroleum and Chemical Industry | | | LU Xiaozhong* | Beijing Institute of Petroleum and Chemical Industry | 2198283238@qq.com |
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| Abstract: |
| The mold cleaning rubber for epoxy resin packaging mold was prepared using natural rubber
and butadiene rubber as the main material with new mold cleaning agent，and the release characteristics of
mold cleaning agent，the bonding strength of mold cleaning rubber and epoxy resin，the swelling of epoxy
resin by the mold cleaning rubber were evaluated. The results showed that compared with the mold cleaning
rubber with sulfur/crosslinking agent BIPB，the rubber containing only BIPB had a better cleaning effect
due to the easy diffusion of the cleaning agent. The bonding strength and swelling property between mold
cleaning rubber and epoxy resin were mainly affected by the curing temperature and curing time. Prolonging
the curing time was beneficial to improving the bonding strength and thereby improving the cleaning effect. |
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