文章摘要
空心玻璃微珠/天然橡胶低导热复合材料的制备及性能研究
Preparation and Properties of Hollow Glass Microsphere/NR Low Thermal Conductivity Composites
投稿时间:2022-08-17  修订日期:2022-08-17
DOI:10.12136/j.issn.1000-890X.2024.04.0243
中文关键词: 空心玻璃微珠  天然橡胶  白炭黑  导热性能  滚动阻力
英文关键词: HGM  NR  silica  thermal conductivity  rolling resistance
基金项目:山东省自然科学基金资助项目(ZR2016XJ003);“泰山学者”建设工程项目;山东省高等学校青年创新团队发展计划项目(2019KJB007)
作者单位E-mail
闫理智 青岛科技大学机 781353687@qq.com 
肖 瑶 青岛科技大学  
唐绍书 青岛科技大学机  
梁金周 青岛科技大学  
续振春 青岛科技大学  
汪传生* 青岛科技大学机 wcsmta@qust.edu.cn 
边慧光 青岛科技大学  
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中文摘要:
      介绍空心玻璃微珠(HGM)/天然橡胶(NR)低导热复合材料(以下简称胶料)的制备及性能研究。结果表明:以HGM适当等量替代白炭黑,可有效降低胶料的储能模量和门尼粘度,改善胶料的加工性能,但不利于胶料的物理性能;减小HGM用量可提高胶料的拉伸强度、拉断伸长率和撕裂强度,但会降低胶料的耐磨性能;HGM等量替代白炭黑有利于胶料的轻量化和提高胶料的隔热性能,可有效降低胶料的滚动阻力。
英文摘要:
      The preparation and properties of hollow glass microsphere(HGM)/natural rubber(NR) low thermal conductivity composites(referred to as compounds) were introduced.The results showed that replacing silica with an appropriate amount of HGM effectively reduced the storage modulus and Mooney viscosity of the compound,and improved the processing properties of the compound,but it was not conducive to the physical properties of the compound.Reducing the amount of HGM could improve the tensile strength,elongation at break and tear strength of the compound,but it could reduce the wear resistance of the compound.Replacing silica with an appropriate amount of HGM was beneficial for the lightweighting of the compound and improving the heat insulation properties of the compound,and effectively reduced the rolling resistance of the compound.
Author NameAffiliationE-mail
YAN Lizhi Qingdao University of Science and Technology 781353687@qq.com 
XIAO Yao Qingdao University of Science and Technology  
TANG Shaoshu Qingdao University of Science and Technology  
LIANG Jinzhou Qingdao University of Science and Technology  
XU Zhenchun Qingdao University of Science and Technology  
WANG Chuansheng Qingdao University of Science and Technology wcsmta@qust.edu.cn 
BIAN Huiguang Qingdao University of Science and Technology  
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