| 绝缘导热加成型有机硅灌封胶的制备及性能研究 |
| Preparation and Properties of Electrical Insulated and Thermal Conductive Addition-Cure Silicone Encapsulant |
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| DOI： |
| 中文关键词: 有机硅灌封胶 加成型 绝缘 导热 |
| 英文关键词: silicone encapsulant addition-cure electrical insulating thermal conductive |
| 基金项目:粤港关键领域重点突破项目（2008A092000002） |
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| 中文摘要: |
| 研究绝缘导热加成型有机硅灌封胶的制备及性能。结果表明：当采用粘度为300和1 000 mPa·s的端乙烯基硅油以质量比40∶60复配、选用活性氢质量分数为0.005 0的含氢硅油且硅氢基/硅乙烯基摩尔比为1.2时，有机硅灌封胶的物理性能较佳；当三氧化二铝用量为150份时，有机硅灌封胶具有良好的综合性能。 |
| 英文摘要: |
| In this study，the electrical insulating and thermal conductive addition-cure silicone encapsulant was prepared and its properties were investigated.The results showed that，when the mass ratio of vinyl end silicone oils with viscosity of 300 and 1 000 mPa·s was 40∶60，active hydrogen mass fraction of hydrogen-containing silicone oil was 0.005 0 and molar ratio of SiH and SiVi was 1.2，the physical properties of silicone encapsulant were good.When the addition level of Al2O3 was 150 phr，the silicone encapsulant had good comprehensive performance. |
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